JPH0225575Y2 - - Google Patents
Info
- Publication number
- JPH0225575Y2 JPH0225575Y2 JP1985086015U JP8601585U JPH0225575Y2 JP H0225575 Y2 JPH0225575 Y2 JP H0225575Y2 JP 1985086015 U JP1985086015 U JP 1985086015U JP 8601585 U JP8601585 U JP 8601585U JP H0225575 Y2 JPH0225575 Y2 JP H0225575Y2
- Authority
- JP
- Japan
- Prior art keywords
- air
- preheater
- soldered
- soldering
- automatic soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985086015U JPH0225575Y2 (en]) | 1985-06-07 | 1985-06-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985086015U JPH0225575Y2 (en]) | 1985-06-07 | 1985-06-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61200647U JPS61200647U (en]) | 1986-12-16 |
JPH0225575Y2 true JPH0225575Y2 (en]) | 1990-07-13 |
Family
ID=30636931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985086015U Expired JPH0225575Y2 (en]) | 1985-06-07 | 1985-06-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0225575Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5844915U (ja) * | 1981-09-22 | 1983-03-25 | 鹿児島工業株式会社 | 折畳洋傘の関節金物 |
-
1985
- 1985-06-07 JP JP1985086015U patent/JPH0225575Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61200647U (en]) | 1986-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100571873B1 (ko) | 리플로우방법및리플로우장치 | |
US6164516A (en) | Soldering apparatus and method | |
KR100391219B1 (ko) | 가스나이프냉각시스템 | |
US5685475A (en) | Apparatus for cooling printed circuit boards in wave soldering | |
JPS60217697A (ja) | 電子部品取り付け取り外し装置 | |
JPH0225575Y2 (en]) | ||
JPH07162139A (ja) | 高温空気循環装置 | |
JP2002001523A (ja) | 局所はんだ付け装置および局所はんだ付け方法 | |
JP2002016352A (ja) | リフロー基板加熱方法とその装置 | |
JPH04257293A (ja) | ディップ半田付工法及び装置 | |
JP2001196735A (ja) | リフローノズル | |
JPH07336040A (ja) | はんだ付け基板の冷却装置 | |
JP2001196736A (ja) | リフロー装置 | |
JPH0741573Y2 (ja) | 自動はんだ付け装置 | |
JPH1098259A (ja) | はんだ付け装置 | |
US20250162053A1 (en) | Jet soldering apparatus | |
KR870002753A (ko) | 표면 장착 기술의 자동 수리장치 | |
JP2002204060A (ja) | はんだ付け方法およびフローはんだ付け装置 | |
JPH0638015Y2 (ja) | 熱間搬送用ガイドレールの熱膨張吸収構造 | |
JP2841885B2 (ja) | リフロー装置 | |
KR19980050039U (ko) | 리플로우 장비의 냉각 및 세정 겸용장치 | |
JP2527452B2 (ja) | はんだ付け装置 | |
JPH05261529A (ja) | 局所はんだ付け装置 | |
JP2010021356A (ja) | 噴流式はんだ付け装置並びに噴流式はんだ付け装置を備えたプリント基板製造システム | |
EP0525718A1 (en) | Automatic soldering apparatus for printed wiring boards |